Flip chip copper plating equipment

The Chip On Flex or Chip On Film (COF) package is one of the main methods for flat panel display driver IC packaging because it meets the short and light trend. The copper plating method is that after the polyimide film is subjected to various pretreatments, copper or other metal is sputtered on the film to form a thin conductive layer, and then a copper layer is formed by wet electrolytic plating.